M38510/54002BYC
vs
5962-8766501XX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SIGNETICS CORP
PYRAMID SEMICONDUCTOR CORP
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
64
64
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
16
16
Bit Size
16
16
Boundary Scan
YES
NO
Clock Frequency-Max
8 MHz
15 MHz
External Data Bus Width
16
16
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
NO
NO
JESD-30 Code
R-XDIP-T64
R-XDIP-T64
Low Power Mode
YES
YES
Number of Terminals
64
64
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-M-38510 Class B
MIL-STD-883 Class B
Speed
8 MHz
15 MHz
Supply Voltage-Max
5.25 V
5.5 V
Supply Voltage-Min
4.75 V
4.5 V
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
MILITARY
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
DUAL
DUAL
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR
Base Number Matches
3
1
Pbfree Code
No
Rohs Code
No
Length
42.2402 mm
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Seated Height-Max
4.191 mm
Terminal Pitch
1.27 mm
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
15.24 mm
Compare M38510/54002BYC with alternatives
Compare 5962-8766501XX with alternatives