M38510/54002BYC vs 5962-8766501XX feature comparison

M38510/54002BYC NXP Semiconductors

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5962-8766501XX Pyramid Semiconductor Corporation

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Part Life Cycle Code Obsolete Active
Ihs Manufacturer SIGNETICS CORP PYRAMID SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP,
Pin Count 64 64
Reach Compliance Code unknown compliant
ECCN Code 3A001.A.2.C 3A001.A.2.C
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 16 16
Bit Size 16 16
Boundary Scan YES NO
Clock Frequency-Max 8 MHz 15 MHz
External Data Bus Width 16 16
Format FLOATING POINT FLOATING POINT
Integrated Cache NO NO
JESD-30 Code R-XDIP-T64 R-XDIP-T64
Low Power Mode YES YES
Number of Terminals 64 64
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B MIL-STD-883 Class B
Speed 8 MHz 15 MHz
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
uPs/uCs/Peripheral ICs Type MICROPROCESSOR MICROPROCESSOR
Base Number Matches 3 1
Pbfree Code No
Rohs Code No
Length 42.2402 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Seated Height-Max 4.191 mm
Terminal Pitch 1.27 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Compare M38510/54002BYC with alternatives

Compare 5962-8766501XX with alternatives