OR4E04-2BM680I
vs
OR4E06-2BM680C
feature comparison
All Stats
Differences Only
Rohs Code
No
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
LATTICE SEMICONDUCTOR CORP
LATTICE SEMICONDUCTOR CORP
Part Package Code
BGA
BGA
Package Description
PLASTIC, FBGA-680
PLASTIC, FBGA-680
Pin Count
680
680
Reach Compliance Code
not_compliant
not_compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
MAXIMUM NO OF USABLE GATES IS 643000
MAXIMUM NO OF USABLE GATES IS 899000
Clock Frequency-Max
420 MHz
420 MHz
Combinatorial Delay of a CLB-Max
0.81 ns
0.81 ns
JESD-30 Code
S-PBGA-B680
S-PBGA-B680
JESD-609 Code
e0
e0
Length
35 mm
35 mm
Moisture Sensitivity Level
3
3
Number of CLBs
1296
2024
Number of Equivalent Gates
333000
471000
Number of Inputs
466
466
Number of Logic Cells
10368
16192
Number of Outputs
466
466
Number of Terminals
680
680
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
1296 CLBS, 333000 GATES
2024 CLBS, 471000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA680,34X34,40
BGA680,34X34,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Peak Reflow Temperature (Cel)
225
225
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.51 mm
2.51 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
30
Width
35 mm
35 mm
Base Number Matches
1
2
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