OMAP5910GGZG2
vs
POMAP5910GGDY2
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
PLASTIC, BGA-289
|
BGA, BGA289,17X17,40
|
Pin Count |
289
|
289
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Additional Feature |
ALSO REQUIRES 2.75V OR 3.3V SUPPLY
|
|
Address Bus Width |
25
|
25
|
Barrel Shifter |
NO
|
NO
|
Bit Size |
16
|
16
|
Boundary Scan |
YES
|
YES
|
Clock Frequency-Max |
13 MHz
|
13 MHz
|
External Data Bus Width |
16
|
16
|
Format |
FIXED POINT
|
FIXED POINT
|
Internal Bus Architecture |
MULTIPLE
|
MULTIPLE
|
JESD-30 Code |
S-PBGA-B289
|
S-PBGA-B289
|
Length |
12 mm
|
19 mm
|
Low Power Mode |
YES
|
YES
|
Number of Terminals |
289
|
289
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
BGA
|
Package Equivalence Code |
BGA289,21X21,20
|
BGA289,17X17,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (words) |
163840
|
163840
|
Seated Height-Max |
1.2 mm
|
2.32 mm
|
Supply Voltage-Max |
1.675 V
|
1.675 V
|
Supply Voltage-Min |
1.525 V
|
1.525 V
|
Supply Voltage-Nom |
1.6 V
|
1.6 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
12 mm
|
19 mm
|
uPs/uCs/Peripheral ICs Type |
DIGITAL SIGNAL PROCESSOR, MIXED
|
DIGITAL SIGNAL PROCESSOR, MIXED
|
Base Number Matches |
2
|
1
|
|
|
|
Compare OMAP5910GGZG2 with alternatives
Compare POMAP5910GGDY2 with alternatives