NX3L1G3157GM-H
vs
NX3L1G3157GM,132
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
SON, SOLCC6,.04,20
|
1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, XSON-6
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-30 Code |
R-PDSO-N6
|
R-PDSO-N6
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| On-state Resistance-Max (Ron) |
4.1 Ω
|
1.7 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SON
|
VSON
|
| Package Equivalence Code |
SOLCC6,.04,20
|
SOLCC6,.04,20
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SON
|
| Pin Count |
|
6
|
| Manufacturer Package Code |
|
SOT886
|
| JESD-609 Code |
|
e3
|
| Length |
|
1.45 mm
|
| Moisture Sensitivity Level |
|
1
|
| Number of Channels |
|
1
|
| Off-state Isolation-Nom |
|
90 dB
|
| On-state Resistance Match-Nom |
|
0.2 Ω
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
|
4.3 V
|
| Supply Voltage-Min (Vsup) |
|
1.4 V
|
| Supply Voltage-Nom (Vsup) |
|
1.65 V
|
| Switch-off Time-Max |
|
30 ns
|
| Switch-on Time-Max |
|
52 ns
|
| Terminal Finish |
|
Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
1 mm
|
|
|
|
Compare NX3L1G3157GM-H with alternatives
Compare NX3L1G3157GM,132 with alternatives