NVT2002DP
vs
MAX14591EWA+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SOIC
|
|
| Package Description |
TSSOP,
|
VFBGA,
|
| Pin Count |
8
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Additional Feature |
Also Required Vref(B) Supply 1.8 to 5.5V
|
|
| Delay-Max |
1.5 ns
|
|
| Input Characteristics |
STANDARD
|
|
| Interface IC Type |
VOLTAGE LEVEL TRANSLATOR
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
S-PDSO-G8
|
R-PBGA-B8
|
| JESD-609 Code |
e4
|
e2
|
| Length |
3 mm
|
1.627 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
2
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
105 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Latch or Register |
NONE
|
|
| Output Polarity |
TRUE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
VFBGA
|
| Package Equivalence Code |
TSSOP8,.19
|
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.1 mm
|
0.69 mm
|
| Supply Voltage-Max |
3.6 V
|
5.5 V
|
| Supply Voltage-Min |
1 V
|
0.9 V
|
| Supply Voltage-Nom |
1.2 V
|
1.2 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN SILVER COPPER NICKEL
|
| Terminal Form |
GULL WING
|
BALL
|
| Terminal Pitch |
0.65 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
3 mm
|
0.837 mm
|
| Base Number Matches |
1
|
1
|
| Supply Voltage1-Max |
|
5.5 V
|
| Supply Voltage1-Min |
|
1.65 V
|
| Supply Voltage1-Nom |
|
3 V
|
| Technology |
|
BICMOS
|
|
|
|
Compare NVT2002DP with alternatives
Compare MAX14591EWA+ with alternatives