NTS0101GW
vs
GT3200-JN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
STANDARD MICROSYSTEMS CORP
Part Package Code
SOT-363
QFP
Package Description
PLASTIC, SOT-363, SC-88, 6 PIN
LFQFP,
Pin Count
6
64
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G6
S-PQFP-G64
Length
2 mm
7 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
6
64
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
LFQFP
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
235
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.6 mm
Supply Voltage-Nom
1.8 V
1.8 V
Surface Mount
YES
YES
Telecom IC Type
INTERFACE CIRCUIT
INTERFACE CIRCUIT
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Pure Tin (Sn)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.4 mm
Terminal Position
DUAL
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
1.25 mm
7 mm
Base Number Matches
2
1
JESD-609 Code
e0
Supply Current-Max
0.46 mA
Compare NTS0101GW with alternatives
Compare GT3200-JN with alternatives