NTRH13D3093DTRF vs RP73G2B309KDTDG feature comparison

NTRH13D3093DTRF NIC Components Corp

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RP73G2B309KDTDG TE Connectivity

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NIC COMPONENTS CORP TE CONNECTIVITY LTD
Package Description SMT, 1206 CHIP
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8533.21.00.30 8533.21.00.30
Construction Rectangular Chip
JESD-609 Code e3
Mounting Feature SURFACE MOUNT SURFACE MOUNT
Number of Terminals 2 2
Operating Temperature-Max 155 °C 155 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.55 mm 0.55 mm
Package Length 3.05 mm 3.05 mm
Package Style SMT SMT
Package Width 1.55 mm 1.55 mm
Packing Method TR, Paper, 7 Inch TR, PAPER, 7 INCH
Rated Power Dissipation (P) 0.333 W 0.25 W
Rated Temperature 70 °C 70 °C
Resistance 309000 Ω 309000 Ω
Resistor Type FIXED RESISTOR FIXED RESISTOR
Size Code 1206 1206
Surface Mount YES YES
Technology THIN FILM THIN FILM
Temperature Coefficient 50 ppm/°C 50 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND WRAPAROUND
Tolerance 0.5% 0.5%
Working Voltage 200 V 200 V
Base Number Matches 1 1
Additional Feature HIGH PRECISION
Manufacturer Series RP73
Package Shape RECTANGULAR PACKAGE
Reference Standard MIL-STD-202
Series RP73

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