NTLJS4114NT1G
vs
NTLJS4159NT1G
feature comparison
Pbfree Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ONSEMI
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
WDFN6, 2 x 2 x 0.75 mm, 0.65 mm Pitch
|
DFN
|
Package Description |
WDFN6, 6 PIN
|
2 X 2 MM, LEAD FREE, CASE 506AP-01, WDFN6, 6 PIN
|
Pin Count |
6
|
6
|
Manufacturer Package Code |
506AP
|
CASE 506AP-01
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
Factory Lead Time |
55 Weeks, 2 Days
|
|
Samacsys Manufacturer |
onsemi
|
|
Additional Feature |
LOGIC LEVEL COMPATIBLE
|
LOGIC LEVEL COMPATIBLE
|
Case Connection |
DRAIN
|
DRAIN
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
30 V
|
30 V
|
Drain Current-Max (ID) |
3.6 A
|
3.6 A
|
Drain-source On Resistance-Max |
0.045 Ω
|
0.045 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-30 Code |
S-XDSO-C6
|
S-XDSO-C6
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
1
|
NOT SPECIFIED
|
Number of Elements |
1
|
1
|
Number of Terminals |
6
|
6
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
150 °C
|
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
3.3 W
|
|
Pulsed Drain Current-Max (IDM) |
28 A
|
28 A
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
C BEND
|
C BEND
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
|
|
|