NTE5562
vs
MCR230F3
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NTE ELECTRONICS INC
|
MOTOROLA INC
|
| Package Description |
POST/STUD MOUNT, O-MUPM-D3
|
POST/STUD MOUNT, O-MUPM-D3
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8541.30.00.80
|
8541.30.00.80
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Configuration |
SINGLE
|
SINGLE
|
| DC Gate Trigger Current-Max |
30 mA
|
25 mA
|
| DC Gate Trigger Voltage-Max |
2 V
|
1.5 V
|
| Holding Current-Max |
50 mA
|
50 mA
|
| JEDEC-95 Code |
TO-48
|
|
| JESD-30 Code |
O-MUPM-D3
|
O-MUPM-D3
|
| Non-Repetitive Pk On-state Cur |
300 A
|
250 A
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
3
|
| On-state Current-Max |
35000 A
|
25000 A
|
| Package Body Material |
METAL
|
METAL
|
| Package Shape |
ROUND
|
ROUND
|
| Package Style |
POST/STUD MOUNT
|
POST/STUD MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RMS On-state Current-Max |
35 A
|
25 A
|
| Repetitive Peak Off-state Voltage |
200 V
|
50 V
|
| Repetitive Peak Reverse Voltage |
200 V
|
50 V
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
SOLDER LUG
|
SOLDER LUG
|
| Terminal Position |
UPPER
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Trigger Device Type |
SCR
|
SCR
|
| Base Number Matches |
1
|
3
|
| Circuit Commutated Turn-off Time-Nom |
|
25 µs
|
| Critical Rate of Rise of Off-State Voltage-Min |
|
100 V/us
|
| Leakage Current-Max |
|
1 mA
|
| On-State Voltage-Max |
|
1.9 V
|
| Operating Temperature-Max |
|
100 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Repetitive Peak Off-state Leakage Current-Max |
|
10 µA
|
|
|
|
Compare NTE5562 with alternatives
Compare MCR230F3 with alternatives