NTD95N02RT4
vs
NTD85N02R-001
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
ROCHESTER ELECTRONICS LLC
|
Package Description |
CASE 369AA-01, DPAK-3
|
CASE 369D, IPAK-3
|
Pin Count |
3
|
3
|
Manufacturer Package Code |
CASE 369AA-01
|
CASE 369D
|
Reach Compliance Code |
unknown
|
unknown
|
Avalanche Energy Rating (Eas) |
84 mJ
|
85 mJ
|
Case Connection |
DRAIN
|
DRAIN
|
Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
DS Breakdown Voltage-Min |
24 V
|
24 V
|
Drain Current-Max (ID) |
32 A
|
85 A
|
Drain-source On Resistance-Max |
0.005 Ω
|
0.0052 Ω
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-30 Code |
R-PSSO-G2
|
R-PSIP-T3
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Number of Terminals |
2
|
3
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
240
|
240
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Qualification Status |
COMMERCIAL
|
COMMERCIAL
|
Surface Mount |
YES
|
NO
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
GULL WING
|
THROUGH-HOLE
|
Terminal Position |
SINGLE
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Transistor Application |
SWITCHING
|
SWITCHING
|
Transistor Element Material |
SILICON
|
SILICON
|
Base Number Matches |
2
|
1
|
Moisture Sensitivity Level |
|
NOT SPECIFIED
|
Pulsed Drain Current-Max (IDM) |
|
192 A
|
|
|
|
Compare NTD95N02RT4 with alternatives
Compare NTD85N02R-001 with alternatives