NTD85N02R-001
vs
PHD96NQ03LT
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NEXPERIA
|
| Package Description |
CASE 369D, IPAK-3
|
SMALL OUTLINE, R-PSSO-G2
|
| Pin Count |
3
|
|
| Manufacturer Package Code |
CASE 369D
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| Avalanche Energy Rating (Eas) |
85 mJ
|
185 mJ
|
| Case Connection |
DRAIN
|
DRAIN
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SINGLE WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
24 V
|
25 V
|
| Drain Current-Max (ID) |
85 A
|
75 A
|
| Drain-source On Resistance-Max |
0.0052 Ω
|
0.0075 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-30 Code |
R-PSIP-T3
|
R-PSSO-G2
|
| JESD-609 Code |
e0
|
e3
|
| Moisture Sensitivity Level |
NOT SPECIFIED
|
1
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
2
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
240
|
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Pulsed Drain Current-Max (IDM) |
192 A
|
240 A
|
| Qualification Status |
COMMERCIAL
|
|
| Surface Mount |
NO
|
YES
|
| Terminal Finish |
TIN LEAD
|
MATTE TIN
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
2
|
3
|
| ECCN Code |
|
EAR99
|
| Date Of Intro |
|
2017-02-01
|
| JEDEC-95 Code |
|
TO-252
|
|
|
|
Compare NTD85N02R-001 with alternatives
Compare PHD96NQ03LT with alternatives