NTD3055L170-1
vs
PHB20N06T
feature comparison
All Stats
Differences Only
Rohs Code
No
Yes
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
ON SEMICONDUCTOR
PHILIPS SEMICONDUCTORS
Package Description
CASE 369D-01, DPAK-3
Pin Count
3
Manufacturer Package Code
CASE 369D-01
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8541.29.00.95
Avalanche Energy Rating (Eas)
30 mJ
Case Connection
DRAIN
Configuration
SINGLE WITH BUILT-IN DIODE
SINGLE
DS Breakdown Voltage-Min
60 V
Drain Current-Max (ID)
9 A
20.3 A
Drain-source On Resistance-Max
0.17 Ω
FET Technology
METAL-OXIDE SEMICONDUCTOR
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code
R-PSIP-T3
JESD-609 Code
e0
e3
Number of Elements
1
1
Number of Terminals
3
Operating Mode
ENHANCEMENT MODE
ENHANCEMENT MODE
Operating Temperature-Max
175 °C
175 °C
Package Body Material
PLASTIC/EPOXY
Package Shape
RECTANGULAR
Package Style
IN-LINE
Polarity/Channel Type
N-CHANNEL
N-CHANNEL
Power Dissipation-Max (Abs)
1.5 W
62 W
Pulsed Drain Current-Max (IDM)
27 A
Qualification Status
Not Qualified
Surface Mount
NO
YES
Terminal Finish
TIN LEAD
MATTE TIN
Terminal Form
THROUGH-HOLE
Terminal Position
SINGLE
Transistor Application
SWITCHING
Transistor Element Material
SILICON
Base Number Matches
1
3
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
245
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