NT5AD512M16C4-HR
vs
MT40A512M16TB-062E:J
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NANYA TECHNOLOGY CORP
|
MICRON TECHNOLOGY INC
|
Package Description |
,
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
Access Mode |
FOUR BANK PAGE BURST
|
MULTI BANK PAGE BURST
|
Clock Frequency-Max (fCLK) |
1333 MHz
|
1600 MHz
|
I/O Type |
COMMON
|
COMMON
|
Interleaved Burst Length |
8
|
8
|
JESD-30 Code |
R-PBGA-B96
|
R-PBGA-B96
|
Length |
13 mm
|
13 mm
|
Memory Density |
8589934592 bit
|
8589934592 bit
|
Memory IC Type |
DDR4 DRAM
|
DDR4 DRAM
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Ports |
1
|
1
|
Number of Terminals |
96
|
96
|
Number of Words |
536870912 words
|
536870912 words
|
Number of Words Code |
512000000
|
512000000
|
Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
Operating Temperature-Max |
95 °C
|
95 °C
|
Operating Temperature-Min |
|
|
Organization |
512MX16
|
512MX16
|
Output Characteristics |
3-STATE
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
TFBGA
|
Package Equivalence Code |
BGA96,9X16,32
|
BGA96,9X16,32
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Self Refresh |
YES
|
YES
|
Sequential Burst Length |
8
|
8
|
Standby Current-Max |
0.022 A
|
|
Supply Current-Max |
0.274 mA
|
|
Supply Voltage-Max (Vsup) |
1.26 V
|
1.26 V
|
Supply Voltage-Min (Vsup) |
1.14 V
|
1.14 V
|
Supply Voltage-Nom (Vsup) |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
7.5 mm
|
7.5 mm
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
Micron
|
Refresh Cycles |
|
8192
|
|
|
|
Compare NT5AD512M16C4-HR with alternatives
Compare MT40A512M16TB-062E:J with alternatives