NRSNA4I4J220TRF
vs
RP104PJ220AS
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NIC COMPONENTS CORP
SAMSUNG SEMICONDUCTOR INC
Package Description
CHIP
SMT, 0804
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8533.21.00.20
Construction
Rectangular
Chip
Element Power Dissipation
0.0625 W
First Element Resistance
22 Ω
JESD-609 Code
e3
e3
Mounting Feature
SURFACE MOUNT
Network Type
ISOLATED
ISOLATED
Number of Elements
1
Number of Functions
4
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.4 mm
0.35 mm
Package Length
2 mm
2 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1 mm
1 mm
Packing Method
TR, PAPER, 7 INCH
TR, Paper, 13 Inch
Rated Temperature
70 °C
Resistance
22 Ω
22 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Second/Last Element Resistance
22 Ω
Size Code
0408
0804
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
250 ppm/°C
Terminal Finish
Matte Tin (Sn) - with Nickel (Ni) barrier
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
25 V
25 V
Base Number Matches
1
1
Rated Power Dissipation (P)
0.0625 W
Compare NRSNA4I4J220TRF with alternatives
Compare RP104PJ220AS with alternatives