NML04D4N7TRF
vs
CIH05T4N7SAC
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NIC COMPONENTS CORP
|
SAMSUNG SEMICONDUCTOR INC
|
| Package Description |
0402
|
0402
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8504.50.80.00
|
|
| Factory Lead Time |
12 Weeks
|
|
| Case/Size Code |
0402
|
0402
|
| Construction |
Rectangular
|
Chip
|
| DC Resistance |
0.2 Ω
|
0.24 Ω
|
| Inductance-Nom (L) |
0.0047 µH
|
0.0047 µH
|
| Inductor Application |
RF INDUCTOR
|
|
| Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
| JESD-609 Code |
e3
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
2
|
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Package Height |
0.5 mm
|
0.5 mm
|
| Package Length |
1 mm
|
1 mm
|
| Package Style |
SMT
|
SMT
|
| Package Width |
0.5 mm
|
0.5 mm
|
| Packing Method |
TR, 7 Inch
|
Tape, Paper
|
| Quality Factor-Min (at L-nom) |
8
|
8
|
| Rated Current-Max |
0.3 A
|
0.3 A
|
| Self Resonance Frequency |
6000 MHz
|
4000 MHz
|
| Shape/Size Description |
RECTANGULAR PACKAGE
|
|
| Shielded |
NO
|
|
| Special Feature |
MULTILAYER
|
|
| Surface Mount |
YES
|
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Placement |
DUAL ENDED
|
|
| Terminal Shape |
WRAPAROUND
|
|
| Test Frequency |
100 MHz
|
|
| Tolerance |
6.383%
|
|
| Base Number Matches |
1
|
2
|
| Core Material |
|
Ceramic
|
| Manufacturer Series |
|
CIH
|
| Series |
|
CIH
|
|
|
|
Compare NML04D4N7TRF with alternatives