NMC27C16BQ200
vs
M38510/21004BLA
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NATIONAL SEMICONDUCTOR CORP
|
LANSDALE SEMICONDUCTOR INC
|
| Package Description |
DIP-24
|
DIP, DIP24,.3
|
| Reach Compliance Code |
unknown
|
compliant
|
| Access Time-Max |
200 ns
|
55 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-GDIP-T24
|
R-XDIP-T24
|
| JESD-609 Code |
e0
|
e0
|
| Memory Density |
16384 bit
|
8192 bit
|
| Memory IC Type |
UVPROM
|
OTP ROM
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Number of Words |
2048 words
|
2048 words
|
| Number of Words Code |
2000
|
1000
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
2KX8
|
1KX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
CERAMIC, GLASS-SEALED
|
UNSPECIFIED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP24,.6
|
DIP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
25 V
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.715 mm
|
|
| Standby Current-Max |
0.0001 A
|
|
| Supply Current-Max |
0.01 mA
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
BIPOLAR
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
15.24 mm
|
|
| Base Number Matches |
3
|
4
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
24
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.32.00.71
|
| Screening Level |
|
MIL-M-38510 Class B
|
|
|
|
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