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M38510/21004BLA vs M38510/21004BJX feature comparison

M38510/21004BLA Lansdale Semiconductor Inc

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M38510/21004BJX QP Semiconductor

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer LANSDALE SEMICONDUCTOR INC QP SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP24,.3 DIP,
Pin Count 24 24
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 55 ns 55 ns
JESD-30 Code R-XDIP-T24 R-XDIP-T24
JESD-609 Code e0
Memory Density 8192 bit 16384 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 24 24
Number of Words 2048 words 2048 words
Number of Words Code 1000 2000
Operating Mode SYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Organization 1KX8 2KX8
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIP DIP
Package Equivalence Code DIP24,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-M-38510 Class B
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade MILITARY MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 4 5
Memory » OTP ROMs
Memory » OTP ROMs

Compare M38510/21004BLA with alternatives

Compare M38510/21004BJX with alternatives