NMC27C128BN250 vs AM27X128-255PI feature comparison

NMC27C128BN250 Texas Instruments

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AM27X128-255PI AMD

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP28,.6 DIP, DIP28,.6
Pin Count 28 28
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Access Time-Max 250 ns 250 ns
I/O Type COMMON
JESD-30 Code R-PDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Length 35.725 mm
Memory Density 131072 bit 131072 bit
Memory IC Type OTP ROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 16KX8 16KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 12.75 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.334 mm
Standby Current-Max 0.0001 A 0.0001 A
Supply Current-Max 0.03 mA 0.025 mA
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm
Base Number Matches 2 2
Additional Feature EXPRESS

Compare NMC27C128BN250 with alternatives

Compare AM27X128-255PI with alternatives