NMC27C128BN250
vs
AM27X128-255PI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
SPANSION INC
Part Package Code
DIP
DIP
Package Description
DIP, DIP28,.6
DIP,
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
250 ns
80 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T28
R-PDIP-T28
JESD-609 Code
e0
Length
35.725 mm
37.084 mm
Memory Density
131072 bit
1048576 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
8
16
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
16384 words
16384 words
Number of Words Code
16000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
16KX8
64KX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.75 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.334 mm
5.715 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
0.025 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
1
1
Compare NMC27C128BN250 with alternatives
Compare AM27X128-255PI with alternatives