NM93C06J
vs
93C06-E/P
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
MICROCHIP TECHNOLOGY INC
Part Package Code
DIP
DIP
Package Description
DIP,
0.300 INCH, PLASTIC, DIP-8
Pin Count
8
8
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
JESD-30 Code
R-GDIP-T8
R-PDIP-T8
Memory Density
256 bit
256 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
16 words
16 words
Number of Words Code
16
16
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
16X16
16X16
Output Characteristics
3-STATE
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.32 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
1
1
Rohs Code
Additional Feature
AUTOMATIC WRITE; 10K ERASE/WRITE CYCLES MIN.; DATA RETENTION > 40 YEARS
Clock Frequency-Max (fCLK)
1 MHz
Data Retention Time-Min
200
Endurance
1000000 Write/Erase Cycles
JESD-609 Code
e0
Length
9.46 mm
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Package Equivalence Code
DIP8,.3
Standby Current-Max
0.0001 A
Supply Current-Max
0.004 mA
Temperature Grade
AUTOMOTIVE
Terminal Finish
TIN LEAD
Write Cycle Time-Max (tWC)
2 ms
Write Protection
SOFTWARE
Compare NM93C06J with alternatives
Compare 93C06-E/P with alternatives