93C06-E/P
vs
M93C06-BN5
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
STMICROELECTRONICS
Part Package Code
DIP
DIP
Package Description
0.300 INCH, PLASTIC, DIP-8
PLASTIC, SDIP-8
Pin Count
8
8
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Additional Feature
AUTOMATIC WRITE; 10K ERASE/WRITE CYCLES MIN.; DATA RETENTION > 40 YEARS
CONFIGURABLE AS 16 X 16
Clock Frequency-Max (fCLK)
1 MHz
1 MHz
Data Retention Time-Min
200
40
Endurance
1000000 Write/Erase Cycles
1000000 Write/Erase Cycles
JESD-30 Code
R-PDIP-T8
R-PDIP-T8
JESD-609 Code
e0
e0
Length
9.46 mm
9.55 mm
Memory Density
256 bit
256 bit
Memory IC Type
EEPROM
EEPROM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
8
8
Number of Words
16 words
16 words
Number of Words Code
16
16
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-20 °C
Organization
16X16
16X16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP8,.3
DIP8,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
SERIAL
SERIAL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.32 mm
5.9 mm
Serial Bus Type
MICROWIRE
MICROWIRE
Standby Current-Max
0.0001 A
0.00005 A
Supply Current-Max
0.004 mA
0.0015 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
OTHER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Write Cycle Time-Max (tWC)
2 ms
10 ms
Write Protection
SOFTWARE
SOFTWARE
Base Number Matches
1
1
Alternate Memory Width
8
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