NM27LC256Q200 vs NMC27C256BN200 feature comparison

NM27LC256Q200 National Semiconductor Corporation

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NMC27C256BN200 National Semiconductor Corporation

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP NATIONAL SEMICONDUCTOR CORP
Package Description WDIP, DIP28,.6 DIP, DIP28,.6
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 200 ns 200 ns
I/O Type COMMON COMMON
JESD-30 Code R-GDIP-T28 R-PDIP-T28
JESD-609 Code e0 e0
Memory Density 262144 bit 262144 bit
Memory IC Type UVPROM OTP ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 28 28
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 32KX8 32KX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code WDIP DIP
Package Equivalence Code DIP28,.6 DIP28,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 13 V 12.75 V
Qualification Status Not Qualified Not Qualified
Standby Current-Max 0.0001 A 0.0001 A
Supply Current-Max 0.009 mA 0.03 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 2 2
Length 35.725 mm
Seated Height-Max 5.334 mm
Width 15.24 mm

Compare NM27LC256Q200 with alternatives

Compare NMC27C256BN200 with alternatives