NMC27C256BN200
vs
27C256MQB/C20
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
THOMSON-CSF SEMICONDUCTORS
Part Package Code
DIP
DIP
Package Description
DIP, DIP28,.6
,
Pin Count
28
28
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
3A001.A.2.C
HTS Code
8542.32.00.71
8542.32.00.61
kg CO2e/kg
12
12
Average Weight (mg)
6890.8
6890.8
CO2e (mg)
82689.598
82689.598
Category CO2 Kg
12
12
Compliance Temperature Grade
Commercial: +0C to +70C
Military: -55C to +125C
Access Time-Max
200 ns
200 ns
I/O Type
COMMON
JESD-30 Code
R-PDIP-T28
R-GDIP-T28
JESD-609 Code
e0
Length
35.725 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
OTP ROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
32KX8
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP28,.6
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
12.75 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.334 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
2
4
Screening Level
MIL-STD-883 Class B
Compare NMC27C256BN200 with alternatives
Compare 27C256MQB/C20 with alternatives