NM27C210NE150
vs
AM27X1024-150PCXXXXX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NATIONAL SEMICONDUCTOR CORP
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
DIP
Package Description
DIP,
DIP,
Pin Count
40
40
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.71
8542.32.00.71
Access Time-Max
150 ns
20 ns
JESD-30 Code
R-PDIP-T40
R-PDIP-T40
Length
52.235 mm
Memory Density
1048576 bit
65536 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
16
8
Number of Functions
1
1
Number of Terminals
40
40
Number of Words
65536 words
65536 words
Number of Words Code
64000
8000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64KX16
8KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.334 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
Base Number Matches
2
1
Rohs Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Supply Current-Max
0.05 mA
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare NM27C210NE150 with alternatives
Compare AM27X1024-150PCXXXXX with alternatives