NLU1GU04CMX1TCG
vs
74AUP1G3208GW
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ONSEMI
|
NEXPERIA
|
Part Package Code |
SOIC
|
|
Package Description |
1 X 1 MM, 0.35 MM PITCH, LEAD FREE, ULLGA-6
|
TSSOP,
|
Pin Count |
6
|
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
|
Family |
1G
|
AUP/ULP/V
|
JESD-30 Code |
S-PDSO-N6
|
R-PDSO-G6
|
JESD-609 Code |
e4
|
e3
|
Length |
1 mm
|
2 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
INVERTER
|
OR-AND GATE
|
Max I(ol) |
0.004 A
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Inputs |
1
|
3
|
Number of Terminals |
6
|
6
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSON
|
TSSOP
|
Package Equivalence Code |
SOLCC6,.04,14
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Prop. Delay@Nom-Sup |
15.5 ns
|
|
Propagation Delay (tpd) |
15.5 ns
|
20.1 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
|
Seated Height-Max |
0.4 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
1.65 V
|
0.8 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
1.1 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.35 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
1 mm
|
1.25 mm
|
Base Number Matches |
1
|
2
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare NLU1GU04CMX1TCG with alternatives
Compare 74AUP1G3208GW with alternatives