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74AUP1G3208GW vs 74LVC1G00GM,132 feature comparison

74AUP1G3208GW NXP Semiconductors

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74LVC1G00GM,132 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOT-363 SON
Package Description TSSOP, TSSOP6,.08 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
Pin Count 6 6
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family AUP/ULP/V LVC/LCX/Z
JESD-30 Code R-PDSO-G6 R-PDSO-N6
JESD-609 Code e3 e3
Length 2 mm 1.45 mm
Load Capacitance (CL) 30 pF 50 pF
Logic IC Type OR-AND GATE NAND GATE
Max I(ol) 0.0017 A 0.024 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 3 2
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Equivalence Code TSSOP6,.08 SOLCC6,.04,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 20.1 ns 6 ns
Propagation Delay (tpd) 20.1 ns 10.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.1 mm 0.5 mm
Supply Voltage-Max (Vsup) 3.6 V 5.5 V
Supply Voltage-Min (Vsup) 0.8 V 1.65 V
Supply Voltage-Nom (Vsup) 1.1 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 1.25 mm 1 mm
Base Number Matches 2 2
Manufacturer Package Code SOT886
Logic » Gates
Logic » Gates

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