NLU1GT126CMX1TCG vs 74AUP1G3208GW feature comparison

NLU1GT126CMX1TCG Rochester Electronics LLC

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74AUP1G3208GW NXP Semiconductors

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Pbfree Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code SOIC SOT-363
Package Description 1 X 1 MM, 0.35 MM PITCH, LEAD FREE, ULLGA-6 TSSOP, TSSOP6,.08
Pin Count 6 6
Reach Compliance Code unknown compliant
Family 1G AUP/ULP/V
JESD-30 Code S-PDSO-N6 R-PDSO-G6
JESD-609 Code e4 e3
Length 1 mm 2 mm
Logic IC Type BUFFER OR-AND GATE
Moisture Sensitivity Level NOT SPECIFIED 1
Number of Functions 1 1
Number of Inputs 1 3
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON TSSOP
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 16 ns 20.1 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 0.4 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 1.65 V 0.8 V
Supply Voltage-Nom (Vsup) 5 V 1.1 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Tin (Sn)
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.35 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1 mm 1.25 mm
Base Number Matches 2 2
Rohs Code Yes
HTS Code 8542.39.00.01
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Package Equivalence Code TSSOP6,.08
Packing Method TR
Prop. Delay@Nom-Sup 20.1 ns
Schmitt Trigger NO

Compare NLU1GT126CMX1TCG with alternatives

Compare 74AUP1G3208GW with alternatives