NLU1G86BMX1TCG
vs
RD74VT1G00CLE
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOIC
|
BGA
|
| Package Description |
1.20 X 1 MM, 0.40 MM PITCH, LEAD FREE, ULLGA-6
|
0.90 X 1.40 MM, 0.50 MM HEIGHT, FBGA-6
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
1G
|
74V
|
| JESD-30 Code |
R-PDSO-N6
|
R-PBGA-B6
|
| JESD-609 Code |
e4
|
|
| Length |
1.2 mm
|
1.4 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
XOR GATE
|
NAND GATE
|
| Max I(ol) |
0.004 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSON
|
VFBGA
|
| Package Equivalence Code |
SOLCC6,.04,16
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
19.5 ns
|
|
| Propagation Delay (tpd) |
19.5 ns
|
9.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
0.4 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
MILITARY
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
BOTTOM
|
| Width |
1 mm
|
0.9 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare NLU1G86BMX1TCG with alternatives
Compare RD74VT1G00CLE with alternatives