RD74VT1G00CLE
vs
HD74LV1GW07ACME
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
BGA
|
SOIC
|
| Package Description |
0.90 X 1.40 MM, 0.50 MM HEIGHT, FBGA-6
|
TSSOP, TSSOP6,.08
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
74V
|
LV/LV-A/LVX/H
|
| JESD-30 Code |
R-PBGA-B6
|
R-PDSO-G6
|
| Length |
1.4 mm
|
2 mm
|
| Logic IC Type |
NAND GATE
|
INVERTER
|
| Number of Functions |
1
|
2
|
| Number of Inputs |
2
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Propagation Delay (tpd) |
9.5 ns
|
36 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
0.5 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.2 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.5 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.65 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Width |
0.9 mm
|
1.25 mm
|
| Base Number Matches |
1
|
1
|
| JESD-609 Code |
|
e6
|
| Load Capacitance (CL) |
|
50 pF
|
| Max I(ol) |
|
0.006 A
|
| Output Characteristics |
|
OPEN-DRAIN
|
| Package Equivalence Code |
|
TSSOP6,.08
|
| Packing Method |
|
TR
|
| Prop. Delay@Nom-Sup |
|
12 ns
|
| Schmitt Trigger |
|
NO
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
TIN BISMUTH
|
|
|
|
Compare RD74VT1G00CLE with alternatives
Compare HD74LV1GW07ACME with alternatives