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NLU1G07CMX1TCG vs 74LVC1G00GM,132 feature comparison

NLU1G07CMX1TCG Rochester Electronics LLC

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74LVC1G00GM,132 NXP Semiconductors

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Pbfree Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROCHESTER ELECTRONICS LLC NXP SEMICONDUCTORS
Part Package Code SOIC SON
Package Description 1 X 1 MM, 0.35 MM PITCH, LEAD FREE, ULLGA-6 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6
Pin Count 6 6
Reach Compliance Code unknown compliant
Family 1G LVC/LCX/Z
JESD-30 Code S-PDSO-N6 R-PDSO-N6
JESD-609 Code e4 e3
Length 1 mm 1.45 mm
Logic IC Type BUFFER NAND GATE
Moisture Sensitivity Level NOT SPECIFIED 1
Number of Functions 1 1
Number of Inputs 1 2
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON VSON
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Propagation Delay (tpd) 14.5 ns 10.5 ns
Qualification Status COMMERCIAL Not Qualified
Seated Height-Max 0.4 mm 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.65 V 1.65 V
Supply Voltage-Nom (Vsup) 5 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade MILITARY AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Tin (Sn)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.35 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1 mm 1 mm
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT886
HTS Code 8542.39.00.01
Load Capacitance (CL) 50 pF
Max I(ol) 0.024 A
Package Equivalence Code SOLCC6,.04,20
Packing Method TR
Prop. Delay@Nom-Sup 6 ns
Schmitt Trigger NO
Logic » Gates
Logic » Gates

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