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74LVC1G00GM,132 vs 74LVC1G00GM feature comparison

74LVC1G00GM,132 NXP Semiconductors

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74LVC1G00GM Philips Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code SON
Package Description 1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6 SON, SOLCC6,.04,20
Pin Count 6
Manufacturer Package Code SOT886
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z
JESD-30 Code R-PDSO-N6 R-PDSO-N6
JESD-609 Code e3
Length 1.45 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.024 A 0.024 A
Moisture Sensitivity Level 1
Number of Functions 1
Number of Inputs 2
Number of Terminals 6 6
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSON SON
Package Equivalence Code SOLCC6,.04,20 SOLCC6,.04,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 6 ns 6 ns
Propagation Delay (tpd) 10.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 0.5 mm
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 1.65 V
Supply Voltage-Nom (Vsup) 1.8 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 1 mm
Base Number Matches 2 3
Logic » Gates
Logic » Gates

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