NLSV4T244MUTAG
vs
NLVSV4T244MUTAG
feature comparison
Pbfree Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ONSEMI
|
ONSEMI
|
Part Package Code |
UQFN12 2.0x1.7, 0.4P
|
|
Package Description |
UQFN-12
|
UQFN-12
|
Pin Count |
12
|
|
Manufacturer Package Code |
523AE
|
523AE
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
17 Weeks
|
|
Samacsys Manufacturer |
onsemi
|
onsemi
|
Family |
4T
|
VSV
|
JESD-30 Code |
R-XQCC-N12
|
R-XQCC-N12
|
JESD-609 Code |
e4
|
e4
|
Length |
2 mm
|
2 mm
|
Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
4
|
4
|
Number of Functions |
1
|
1
|
Number of Ports |
2
|
2
|
Number of Terminals |
12
|
12
|
Operating Temperature-Max |
85 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
3-STATE
|
3-STATE
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
VQCCN
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
3.3 ns
|
3.3 ns
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.55 mm
|
0.55 mm
|
Supply Voltage-Max (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Min (Vsup) |
0.9 V
|
0.9 V
|
Supply Voltage-Nom (Vsup) |
1.2 V
|
1.8 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.4 mm
|
0.4 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.7 mm
|
1.7 mm
|
Base Number Matches |
1
|
1
|
Additional Feature |
|
ALSO REQIRED 0.9 TO 4.5 V SUPPLY
|
Screening Level |
|
AEC-Q100
|
|
|
|
Compare NLSV4T244MUTAG with alternatives
Compare NLVSV4T244MUTAG with alternatives