NLAS5223BMNR2G
vs
ADG619BRT-R2
feature comparison
All Stats
Differences Only
Pbfree Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ONSEMI
ANALOG DEVICES INC
Part Package Code
WQFN10 1.4 x 1.8, 0.4mm Pitch
SOIC
Package Description
WQFN-10
PLASTIC, MO-178BA, SOT-23, 8 PIN
Pin Count
10
8
Manufacturer Package Code
488AQ
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
14 Weeks
Samacsys Manufacturer
onsemi
Analog IC - Other Type
SPDT
SPDT
JESD-30 Code
R-XQCC-N10
R-PDSO-G8
JESD-609 Code
e4
e0
Length
1.8 mm
2.9 mm
Moisture Sensitivity Level
1
Number of Channels
1
2
Number of Functions
2
1
Number of Terminals
10
8
Off-state Isolation-Nom
68 dB
67 dB
On-state Resistance Match-Nom
0.05 Ω
0.7 Ω
On-state Resistance-Max (Ron)
0.4 Ω
6 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output
SEPARATE OUTPUT
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VQCCN
LSSOP
Package Equivalence Code
LCC10,.06X.07,16
TSSOP8,.1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, VERY THIN PROFILE
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.8 mm
1.45 mm
Supply Voltage-Max (Vsup)
4.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.65 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
5 V
Surface Mount
YES
YES
Switch-off Time-Max
30 ns
75 ns
Switch-on Time-Max
50 ns
120 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
NICKEL PALLADIUM GOLD
TIN LEAD
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.4 mm
0.65 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
1.4 mm
1.6 mm
Base Number Matches
1
1
Rohs Code
ECCN Code
EAR99
Neg Supply Voltage-Max (Vsup)
-5.5 V
Neg Supply Voltage-Min (Vsup)
-2.7 V
Neg Supply Voltage-Nom (Vsup)
-5 V
Compare NLAS5223BMNR2G with alternatives
Compare ADG619BRT-R2 with alternatives