NLAS4684FCT1 vs MAX4685EBC-T feature comparison

NLAS4684FCT1 onsemi

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MAX4685EBC-T Maxim Integrated Products

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Pbfree Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ONSEMI MAXIM INTEGRATED PRODUCTS INC
Part Package Code 10 PIN FLIP-CHIP BGA
Package Description MICROBUMP-10 0.50 MM PITCH, UCSP-12
Pin Count 10 12
Manufacturer Package Code 489AA
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer onsemi
Analog IC - Other Type SPDT SPDT
JESD-30 Code R-PBGA-B10 R-PBGA-B12
JESD-609 Code e0 e0
Length 1.965 mm 2.02 mm
Moisture Sensitivity Level 1 1
Number of Channels 1 1
Number of Functions 2 2
Number of Terminals 10 12
Off-state Isolation-Nom 65 dB 64 dB
On-state Resistance Match-Nom 0.06 Ω 0.06 Ω
On-state Resistance-Max (Ron) 1 Ω 0.8 Ω
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output SEPARATE OUTPUT SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Equivalence Code BGA10,3X4,20 BGA12,3X4,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 240 245
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.65 mm 0.67 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.8 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Switch-off Time-Max 50 ns 30 ns
Switch-on Time-Max 60 ns 50 ns
Switching BREAK-BEFORE-MAKE BREAK-BEFORE-MAKE
Technology CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 1.465 mm 1.54 mm
Base Number Matches 2 2
Rohs Code No
ECCN Code EAR99

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