MAX4685EBC-T
vs
MAX4685EUB+T
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
BGA
|
SOIC
|
Package Description |
0.50 MM PITCH, UCSP-12
|
ROHS COMPLIANT, UMAX-10
|
Pin Count |
12
|
10
|
Reach Compliance Code |
not_compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Analog IC - Other Type |
SPDT
|
SPDT
|
JESD-30 Code |
R-PBGA-B12
|
S-PDSO-G10
|
JESD-609 Code |
e0
|
e3
|
Length |
2.02 mm
|
3 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
1
|
2
|
Number of Functions |
2
|
1
|
Number of Terminals |
12
|
10
|
Off-state Isolation-Nom |
64 dB
|
64 dB
|
On-state Resistance Match-Nom |
0.06 Ω
|
0.06 Ω
|
On-state Resistance-Max (Ron) |
0.8 Ω
|
0.8 Ω
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output |
SEPARATE OUTPUT
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
TSSOP
|
Package Equivalence Code |
BGA12,3X4,20
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
245
|
260
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
0.67 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.3 V
|
Supply Voltage-Min (Vsup) |
1.8 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Switch-off Time-Max |
30 ns
|
40 ns
|
Switch-on Time-Max |
50 ns
|
60 ns
|
Switching |
BREAK-BEFORE-MAKE
|
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN
|
Terminal Form |
BALL
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Width |
1.54 mm
|
3 mm
|
Base Number Matches |
2
|
3
|
Technology |
|
BICMOS
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MAX4685EBC-T with alternatives
Compare MAX4685EUB+T with alternatives