NL27WZ04DTT1
vs
74LVC2G06GF
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
NEXPERIA
|
| Part Package Code |
TSOP
|
|
| Package Description |
TSOP-6
|
VSON,
|
| Pin Count |
6
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Family |
27WZ
|
LVC/LCX/Z
|
| JESD-30 Code |
R-PDSO-G6
|
S-PDSO-N6
|
| JESD-609 Code |
e0
|
e3
|
| Length |
3 mm
|
1 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
INVERTER
|
INVERTER
|
| Max I(ol) |
0.024 A
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
VSON
|
| Package Equivalence Code |
TSOP6,.11,37
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
235
|
260
|
| Propagation Delay (tpd) |
11 ns
|
8.2 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
1.1 mm
|
0.5 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.65 V
|
1.65 V
|
| Supply Voltage-Nom (Vsup) |
1.8 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Finish |
TIN LEAD
|
TIN
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.95 mm
|
0.35 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.5 mm
|
1 mm
|
| Base Number Matches |
2
|
2
|
| Output Characteristics |
|
OPEN-DRAIN
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare NL27WZ04DTT1 with alternatives
Compare 74LVC2G06GF with alternatives