NIN-HDR18JTRF
vs
AISC-0805-R18J-T
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Not Recommended
|
Active
|
Ihs Manufacturer |
NIC COMPONENTS CORP
|
ABRACON LLC
|
Package Description |
CHIP, 0805, ROHS COMPLIANT
|
0805
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8504.50.80.00
|
8504.50.80.00
|
Factory Lead Time |
14 Weeks
|
14 Weeks
|
Case/Size Code |
0805
|
0805
|
Construction |
Chip
|
Chip
|
DC Resistance |
0.64 Ω
|
0.64 Ω
|
Inductance-Nom (L) |
0.18 µH
|
0.18 µH
|
Inductor Application |
HIGH CURRENT INDUCTOR
|
RF INDUCTOR
|
Inductor Type |
GENERAL PURPOSE INDUCTOR
|
GENERAL PURPOSE INDUCTOR
|
JESD-609 Code |
e3
|
e4
|
Number of Functions |
1
|
1
|
Number of Terminals |
2
|
2
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Height |
1.55 mm
|
1.55 mm
|
Package Length |
2.29 mm
|
2.29 mm
|
Package Style |
SMT
|
SMT
|
Package Width |
1.68 mm
|
1.73 mm
|
Packing Method |
TR, Embossed, 7 Inch
|
TR
|
Quality Factor-Min (at L-nom) |
50
|
50
|
Rated Current-Max |
0.4 A
|
0.4 A
|
Self Resonance Frequency |
870 MHz
|
870 MHz
|
Shape/Size Description |
RECTANGULAR PACKAGE
|
RECTANGULAR PACKAGE
|
Shielded |
NO
|
NO
|
Special Feature |
Q MEASURED@250MHZ
|
Q MEASURED AT 250 MHZ
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin (Sn) - with Nickel (Ni) barrier
|
GOLD OVER NICKEL
|
Terminal Placement |
DUAL ENDED
|
DUAL ENDED
|
Terminal Shape |
ONE SURFACE
|
WRAPAROUND
|
Test Frequency |
100 MHz
|
1000 MHz
|
Tolerance |
5%
|
5%
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
ABRACON
|
Core Material |
|
CERAMIC
|
|
|
|
Compare NIN-HDR18JTRF with alternatives
Compare AISC-0805-R18J-T with alternatives