NG80960JF3V25 vs KD80386DX20 feature comparison

NG80960JF3V25 Rochester Electronics LLC

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KD80386DX20 Intel Corporation

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer ROCHESTER ELECTRONICS INC INTEL CORP
Part Package Code QFP QFP
Package Description QFP, BQFP,
Pin Count 132 132
Reach Compliance Code unknown unknown
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES NO
Clock Frequency-Max 25 MHz 40 MHz
External Data Bus Width 32 32
Format FIXED POINT FIXED POINT
Integrated Cache YES NO
JESD-30 Code S-PQFP-G132 S-PQFP-G132
Low Power Mode YES NO
Number of Terminals 132 132
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP BQFP
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, BUMPER
Qualification Status COMMERCIAL Not Qualified
Speed 25 MHz 20 MHz
Supply Voltage-Max 3.45 V 5.25 V
Supply Voltage-Min 3.15 V 4.75 V
Supply Voltage-Nom 3.3 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form GULL WING GULL WING
Terminal Position QUAD QUAD
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR
Base Number Matches 2 1
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Additional Feature DYNAMIC BUS SIZING; CONTROL ROM; BARREL SHIFTER
Length 24.13 mm
Number of DMA Channels
Number of External Interrupts 2
Number of Serial I/Os
On Chip Data RAM Width
Operating Temperature-Max 100 °C
Operating Temperature-Min
RAM (words) 0
Seated Height-Max 4.32 mm
Supply Current-Max 260 mA
Temperature Grade OTHER
Terminal Pitch 0.635 mm
Width 24.13 mm

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