NE532D
vs
LM258J
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
STMICROELECTRONICS
Part Package Code
SOIC
DIP
Package Description
3.90 MM, PLASTIC, SO-8
DIP, DIP8,.3
Pin Count
8
8
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.33.00.01
8542.33.00.01
Amplifier Type
OPERATIONAL AMPLIFIER
OPERATIONAL AMPLIFIER
Average Bias Current-Max (IIB)
0.5 µA
0.2 µA
Common-mode Reject Ratio-Nom
70 dB
60 dB
Input Offset Voltage-Max
9000 µV
7000 µV
JESD-30 Code
R-PDSO-G8
R-CDIP-T8
Length
4.9 mm
Neg Supply Voltage Limit-Max
Neg Supply Voltage-Nom (Vsup)
Number of Functions
2
2
Number of Terminals
8
8
Operating Temperature-Max
70 °C
105 °C
Operating Temperature-Min
-40 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
5.08 mm
Slew Rate-Nom
0.3 V/us
0.6 V/us
Supply Voltage Limit-Max
32 V
32 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Unity Gain BW-Nom
1000
1100
Width
3.9 mm
7.62 mm
Base Number Matches
3
5
Pbfree Code
Rohs Code
Architecture
VOLTAGE-FEEDBACK
Bias Current-Max (IIB) @25C
0.1 µA
Frequency Compensation
YES
JESD-609 Code
e0
Low-Offset
NO
Package Equivalence Code
DIP8,.3
Slew Rate-Min
0.3 V/us
Supply Current-Max
2 mA
Terminal Finish
TIN LEAD
Voltage Gain-Min
25000
Compare NE532D with alternatives
Compare LM258J with alternatives