NCP370MUAITXG
vs
VNN3NV04PTR-E
feature comparison
Pbfree Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
ONSEMI
|
STMICROELECTRONICS
|
Part Package Code |
LLGA12 3x3, 0.5P
|
SOT-223
|
Package Description |
LLGA-12
|
ROHS COMPLIANT, SOT-223, 4 PIN
|
Pin Count |
12
|
4
|
Manufacturer Package Code |
513AK
|
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
4 Weeks
|
13 Weeks
|
Samacsys Manufacturer |
onsemi
|
STMicroelectronics
|
Built-in Protections |
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL
|
TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL
|
Interface IC Type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
JESD-30 Code |
R-PBGA-B12
|
R-PDSO-G4
|
JESD-609 Code |
e4
|
e3
|
Length |
3 mm
|
6.5 mm
|
Moisture Sensitivity Level |
1
|
3
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
4
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Current Flow Direction |
SOURCE
|
SINK
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFLGA
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
0.6 mm
|
1.9 mm
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Matte Tin (Sn) - annealed
|
Terminal Form |
BUTT
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
2.3 mm
|
Terminal Position |
BOTTOM
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Turn-off Time |
5 µs
|
10 µs
|
Turn-on Time |
4000 µs
|
1.35 µs
|
Width |
3 mm
|
3.5 mm
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Output Peak Current Limit-Nom |
|
5 A
|
Package Equivalence Code |
|
SOT-223-4
|
|
|
|