NCP1402SN19T1
vs
SA57250-20GW-G
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ONSEMI
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSOP
|
SOIC
|
| Package Description |
SC-59, SOT-23, TSOP-5
|
LSSOP,
|
| Pin Count |
5
|
5
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| Samacsys Manufacturer |
onsemi
|
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
VOLTAGE-MODE
|
|
| Control Technique |
PULSE FREQUENCY MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
6 V
|
9 V
|
| Input Voltage-Min |
0.95 V
|
0.7 V
|
| Input Voltage-Nom |
6 V
|
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e0
|
|
| Length |
3 mm
|
2.85 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Current-Max |
0.4 A
|
0.3 A
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
LSSOP
|
| Package Equivalence Code |
TSOP5/6,.11,37
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
235
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.35 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BOOST
|
BOOST
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.5 mm
|
1.6 mm
|
| Base Number Matches |
2
|
1
|
| Switching Frequency-Max |
|
57.5 kHz
|
|
|
|
Compare NCP1402SN19T1 with alternatives
Compare SA57250-20GW-G with alternatives