NC7WP02K8X
vs
74LVC3G04GM
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
FAIRCHILD SEMICONDUCTOR CORP
|
NEXPERIA
|
Part Package Code |
VSOP
|
|
Package Description |
3.10 MM, MO-187CA, US-8
|
HVQCCN,
|
Pin Count |
8
|
|
Manufacturer Package Code |
8LD, US8, JEDEC MO-187, 2.3MM WIDE
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
P
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G8
|
S-PQCC-N8
|
JESD-609 Code |
e3
|
e4
|
Length |
2.3 mm
|
1.6 mm
|
Load Capacitance (CL) |
30 pF
|
|
Logic IC Type |
NOR GATE
|
INVERTER
|
Max I(ol) |
0.0005 A
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
3
|
Number of Inputs |
2
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
HVQCCN
|
Package Equivalence Code |
TSSOP8,.12,20
|
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Prop. Delay@Nom-Sup |
43 ns
|
|
Propagation Delay (tpd) |
43 ns
|
9.5 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
|
Seated Height-Max |
0.9 mm
|
0.5 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
0.9 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
1.2 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
2 mm
|
1.6 mm
|
Base Number Matches |
2
|
3
|
|
|
|
Compare NC7WP02K8X with alternatives
Compare 74LVC3G04GM with alternatives