NC7SZ27L6X
vs
74HCT2G04GV
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
MicroPak
TSOP
Package Description
1 MM, MICROPAK-6
PLASTIC, SOT457, SC-74, TSOP-6
Pin Count
6
6
Manufacturer Package Code
6LD, MICROPAK, JEDEC MO-252,1.0MM WIDE (Logic style X overs)
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
HCT
JESD-30 Code
R-XQCC-N6
R-PDSO-G6
JESD-609 Code
e4
e3
Length
1.45 mm
2.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NOR GATE
INVERTER
Max I(ol)
0.024 A
0.0045 A
Moisture Sensitivity Level
1
1
Number of Functions
1
2
Number of Inputs
3
1
Number of Terminals
6
6
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VQCCN
TSSOP
Package Equivalence Code
SOLCC6,.04,20
TSOP6,.11,37
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
8.5 ns
22 ns
Propagation Delay (tpd)
19 ns
29 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
0.55 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
6 V
Supply Voltage-Min (Vsup)
1.65 V
2 V
Supply Voltage-Nom (Vsup)
1.8 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
NICKEL GOLD
Tin (Sn)
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.95 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1 mm
1.5 mm
Base Number Matches
1
5
Compare NC7SZ27L6X with alternatives
Compare 74HCT2G04GV with alternatives