74HCT2G04GV
vs
74LVC1G00GF
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
TSOP
Package Description
PLASTIC, SOT457, SC-74, TSOP-6
VSON,
Pin Count
6
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
LVC/LCX/Z
JESD-30 Code
R-PDSO-G6
S-PDSO-N6
JESD-609 Code
e3
e3
Length
2.9 mm
1 mm
Load Capacitance (CL)
50 pF
Logic IC Type
INVERTER
NAND GATE
Max I(ol)
0.0045 A
Moisture Sensitivity Level
1
1
Number of Functions
2
1
Number of Inputs
1
2
Number of Terminals
6
6
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
VSON
Package Equivalence Code
TSOP6,.11,37
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
22 ns
Propagation Delay (tpd)
29 ns
10.5 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.1 mm
0.5 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
1.65 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Tin (Sn)
TIN
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.95 mm
0.35 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1.5 mm
1 mm
Base Number Matches
2
2
Compare 74HCT2G04GV with alternatives
Compare 74LVC1G00GF with alternatives