NC7SV08L6X
vs
74LVC1G04GM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
NXP SEMICONDUCTORS
Part Package Code
MICROPAK MLP
SON
Package Description
1 MM, ROHS COMPLIANT, MO-252UAAD, MICROPAK-6
VSON, SOLCC6,.04,20
Pin Count
6
6
Manufacturer Package Code
6LD, MICROPAK, JEDEC MO-252, 1.0MM WIDE - MLP (PREMOLDED)
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
AUP/ULP/V
LVC/LCX/Z
JESD-30 Code
R-PDSO-N6
R-PDSO-N6
JESD-609 Code
e4
e3
Length
1.45 mm
1.45 mm
Load Capacitance (CL)
30 pF
Logic IC Type
AND GATE
INVERTER
Max I(ol)
0.002 A
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
2
1
Number of Terminals
6
6
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VSON
VSON
Package Equivalence Code
SOLCC6,.04,20
SOLCC6,.04,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, VERY THIN PROFILE
SMALL OUTLINE, VERY THIN PROFILE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
14.6 ns
Propagation Delay (tpd)
14.6 ns
9.5 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
0.55 mm
0.5 mm
Supply Voltage-Max (Vsup)
3.6 V
5.5 V
Supply Voltage-Min (Vsup)
0.9 V
1.65 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD
Tin (Sn)
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
1 mm
1 mm
Base Number Matches
3
3
Compare NC7SV08L6X with alternatives
Compare 74LVC1G04GM with alternatives