NANDB1R3N0CZPA5F vs NANDA9R3N0DZPA5F feature comparison

NANDB1R3N0CZPA5F Numonyx Memory Solutions

Buy Now Datasheet

NANDA9R3N0DZPA5F Numonyx Memory Solutions

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NUMONYX NUMONYX
Part Package Code BGA BGA
Package Description TFBGA, BGA152,21X21,25 TFBGA, BGA152,21X21,25
Pin Count 152 152
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
JESD-30 Code S-PBGA-B152 S-PBGA-B152
Length 14 mm 14 mm
Memory Density 2147483648 bit 1073741824 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 8 8
Mixed Memory Type FLASH+SDRAM FLASH+SDRAM
Number of Functions 1 1
Number of Terminals 152 152
Number of Words 268435456 words 134217728 words
Number of Words Code 256000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -30 °C
Organization 256MX8 128MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Equivalence Code BGA152,21X21,25 BGA152,21X21,25
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Form BALL BALL
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 2 2

Compare NANDB1R3N0CZPA5F with alternatives

Compare NANDA9R3N0DZPA5F with alternatives