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NAND512W3A3CN1F vs K9F1208U0CPIB00 feature comparison

NAND512W3A3CN1F STMicroelectronics

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K9F1208U0CPIB00 Samsung Semiconductor

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STMICROELECTRONICS SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP TSOP1
Package Description TSOP1, TSSOP,
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Access Time-Max 12000 ns 40 ns
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e3
Length 18.4 mm 20 mm
Memory Density 536870912 bit 512753664 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 67108864 words 64094208 words
Number of Words Code 64000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 64MX8 64MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3.3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 1 2
Memory » Flash Memories
Memory » Flash Memories

Compare NAND512W3A3CN1F with alternatives

Compare K9F1208U0CPIB00 with alternatives