K9F1208U0CPIB00
vs
NAND512W3A1AN1F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
STMICROELECTRONICS
Part Package Code
TSOP1
TSOP
Package Description
TSSOP,
TSOP1, TSSOP48,.8,20
Pin Count
48
48
Reach Compliance Code
unknown
unknown
Access Time-Max
40 ns
12000 ns
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
Length
20 mm
18.4 mm
Memory Density
512753664 bit
536870912 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
64094208 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
64MX8
64MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
3.3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Width
12 mm
12 mm
Base Number Matches
1
2
Rohs Code
ECCN Code
EAR99
HTS Code
8542.32.00.51
Command User Interface
YES
Data Polling
NO
JESD-609 Code
e3/e6
Number of Sectors/Size
4K
Package Equivalence Code
TSSOP48,.8,20
Page Size
512 words
Peak Reflow Temperature (Cel)
260
Ready/Busy
YES
Sector Size
16K
Standby Current-Max
0.00005 A
Supply Current-Max
0.02 mA
Terminal Finish
TIN/TIN BISMUTH
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Toggle Bit
NO
Compare K9F1208U0CPIB00 with alternatives
Compare NAND512W3A1AN1F with alternatives