K9F1208U0CPIB00 vs NAND512W3A1AN1F feature comparison

K9F1208U0CPIB00 Samsung Semiconductor

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NAND512W3A1AN1F STMicroelectronics

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC STMICROELECTRONICS
Part Package Code TSOP1 TSOP
Package Description TSSOP, TSOP1, TSSOP48,.8,20
Pin Count 48 48
Reach Compliance Code unknown unknown
Access Time-Max 40 ns 12000 ns
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 20 mm 18.4 mm
Memory Density 512753664 bit 536870912 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 64094208 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64MX8 64MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3.3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 1 2
Rohs Code Yes
ECCN Code EAR99
HTS Code 8542.32.00.51
Command User Interface YES
Data Polling NO
JESD-609 Code e3/e6
Number of Sectors/Size 4K
Package Equivalence Code TSSOP48,.8,20
Page Size 512 words
Peak Reflow Temperature (Cel) 260
Ready/Busy YES
Sector Size 16K
Standby Current-Max 0.00005 A
Supply Current-Max 0.02 mA
Terminal Finish TIN/TIN BISMUTH
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Toggle Bit NO

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