NAND128W4A0BN6T vs K3P9U1000M-YC12 feature comparison

NAND128W4A0BN6T STMicroelectronics

Buy Now Datasheet

K3P9U1000M-YC12 Samsung Semiconductor

Buy Now Datasheet
Rohs Code No No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer STMICROELECTRONICS SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP TSOP1
Package Description TSOP1, TSOP1, TSSOP48,.8,20
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.71
Access Time-Max 35 ns 120 ns
JESD-30 Code R-PDSO-G48 R-PDSO-G48
JESD-609 Code e0 e0
Length 18.4 mm 16.4 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH MASK ROM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1 TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Type SLC NAND TYPE
Width 12 mm 12 mm
Base Number Matches 1 1
Alternate Memory Width 8
Package Equivalence Code TSSOP48,.8,20
Standby Current-Max 0.00003 A
Supply Current-Max 0.07 mA

Compare NAND128W4A0BN6T with alternatives

Compare K3P9U1000M-YC12 with alternatives