NAND02GW3B3AN1F
vs
NAND02GW4B3BN1E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
TSOP
TSOP
Package Description
TSOP1, TSSOP48,.8,20
TSOP1,
Pin Count
48
48
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
35 ns
35 ns
Command User Interface
YES
Data Polling
NO
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e3/e6
e3
Length
18.4 mm
18.4 mm
Memory Density
2147483648 bit
2147483648 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
16
Number of Functions
1
1
Number of Sectors/Size
2K
Number of Terminals
48
48
Number of Words
268435456 words
134217728 words
Number of Words Code
256000000
128000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256MX8
128MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Equivalence Code
TSSOP48,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Page Size
2K words
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
128K
Standby Current-Max
0.00005 A
Supply Current-Max
0.02 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN/TIN BISMUTH
TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Toggle Bit
NO
Width
12 mm
12 mm
Base Number Matches
1
1
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Compare NAND02GW4B3BN1E with alternatives